1. | Approved capital appropriations of US$2,240.8 million to expand advanced technology capacity for twelve-inch wafer fabs, and increase twelve-inch capacity for wafer level chip scale packaging process. | |
2. | Approved capital appropriations of US$254.6 million to expand 12-inch wafer fab facilities. | |
3. | Approved capital appropriations of US$46 million to set up a production line and product development lab for solid state lighting. | |
4. | Appointed Dr. Jack Sun as Chief Technology Officer of TSMC, in charge of formulating TSMCs technology strategy and conducting the development of the companys most advanced technologies. Dr. Sun will report directly to Dr. S.Y. Chiang, Senior Vice President of Research and Development. |
TSMC Spokesperson | TSMC Acting Spokesperson: | For Further Information: | ||||
Ms. Lora Ho Vice President and CFO Tel: 886-3-566-4602 |
Mr. J.H. Tzeng Deputy Director PR Department Tel: 886-3-505-5028 Mobile: 886-928-882-607 E-Mail: jhtzeng@tsmc.com |
Michael Kramer Principal Specialist PR Department Tel: 886-3-563-6688 ext.7126216 Mobile: 886-926-026-632 E-Mail: pdkramer@tsmc.com |
Dana Tsai Senior Administrator, PR Department Tel: 886-3-505-5036 Mobile: 886-920-483591 E-Mail:dana_tsai@tsmc.com |
Taiwan Semiconductor Manufacturing Company Ltd. |
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Date: November 10, 2009 | By | /s/ Lora Ho | ||
Lora Ho | ||||
Vice President & Chief Financial Officer | ||||