Sign In  |  Register  |  About Santa Clara  |  Contact Us

Santa Clara, CA
September 01, 2020 1:39pm
7-Day Forecast | Traffic
  • Search Hotels in Santa Clara

  • CHECK-IN:
  • CHECK-OUT:
  • ROOMS:

Cohu to Present at Upcoming Investor Conferences

Cohu, Inc. (NASDAQ: COHU), a global leader in back-end semiconductor equipment and services, today announced that management will participate at the following investor conferences:

  • Cowen 49th Annual Technology, Media & Telecom Virtual Conference on Tuesday, June 1, 2021 with one-on-one meeting format.
  • 18th Annual Craig-Hallum Institutional Investor Virtual Conference on Wednesday, June 2, 2021 with one-on-one meeting format.
  • Stifel 2021 Virtual Cross Sector Insight Conference on Wednesday, June 9, 2021 with one-on-one meeting format and presentation scheduled for 4:40 p.m. – 5:10 p.m. EDT.
  • Baird's 2021 Global Consumer, Technology & Services Virtual Conference on Thursday, June 10, 2021 with one-on-one meeting format and presentation scheduled for 3:45 p.m. – 4:15 p.m. EDT.

Presentation materials will be made concurrently available on the Investor Relations section of the Company’s website, www.cohu.com. Portfolio managers and analysts should contact their respective banking representatives to schedule a meeting at these conferences.

About Cohu:

Cohu (NASDAQ: COHU) is a global leader in back-end semiconductor equipment and services, delivering leading-edge solutions for the manufacturing of semiconductors and printed circuit boards. Additional information can be found at www.cohu.com.

For press releases and other information of interest to investors, please visit Cohu’s website at www.cohu.com.

Contacts

Cohu, Inc.

Jeffrey D. Jones - Investor Relations

858-848-8106

Stock Quote API & Stock News API supplied by www.cloudquote.io
Quotes delayed at least 20 minutes.
By accessing this page, you agree to the following
Privacy Policy and Terms and Conditions.
 
 
Copyright © 2010-2020 SantaClara.com & California Media Partners, LLC. All rights reserved.