JetCool, a leading liquid cooling company for data centers, and Flex (NASDAQ: FLEX) today announced a partnership to address the growing demand for AI servers and high-density compute from hyperscalers and enterprise customers. The companies are building rack-level solutions, including a new line of co-designed liquid cooling-ready servers that are compliant with Open Compute Project (OCP) specification.

The new servers leverage JetCool’s patented microconvective liquid cooling technology that uses precision jets to target and cool processor hot spots. This precision cooling manages the increased heat from high-performance AI and compute workloads, ensuring optimal performance and reliability. Additionally, these liquid-cooled servers provide a versatile platform for hyperscalers to design customized AI chip architectures and tailored server configurations to meet unique performance requirements.

JetCool is also launching a 6U in-rack Coolant Distribution Unit (CDU) that is capable of cooling 300kW and scalable to 2.1MW at a row level. At the 2024 OCP Global Summit, JetCool will also demonstrate its fully-sealed SmartPlate cold plate, which cools superchips over 3kW, showcasing the significant headroom potential for single-phase direct-to-chip liquid cooling for high-performance applications, using sustainable non-toxic fluids.

“Advanced cooling systems are essential for supporting AI-enabled applications, high-performance computing, and increased rack power densities,” said Rob Campbell, president of Communications, Enterprise and Cloud at Flex. “JetCool extends the value of single-phase, direct-to-chip liquid cooling deployments to meet the escalating power demands of AI servers. Flex’s expertise across IT and power infrastructure, global manufacturing, and vertical integration makes these solutions easier to deploy at scale.”

“As AI and other high-density workloads push the limits of conventional cooling methods, the need for advanced solutions becomes critical,” said Dr. Bernie Malouin, CEO of JetCool. “Partnering with Flex allows us to combine our cutting-edge liquid cooling solutions with Flex’s unparalleled manufacturing capabilities. Together, we are poised to deliver servers for AI at scale that not only meet but exceed the performance and efficiency requirements of hyperscalers and enterprise customers.”

Together, JetCool and Flex provide a complete rack-level solution for AI-enabled applications, delivering integrated cooling and server technology that supports the full spectrum of AI workloads and high-performance computing with unmatched efficiency and scalability. View JetCool's portfolio of offerings at the Flex booth A11 and at JetCool booth A21 at the 2024 OCP Global Summit taking place at the San Jose Convention Center in San Jose, CA from October 15-17, 2024. For more information, please visit jetcool.com.

About JetCool

JetCool is catalyzing breakthroughs in thermal management for compute-intensive applications. The company’s liquid cooling solutions provide the essential foundation for semiconductor manufacturers, hyperscalers, and their partners to advance innovations in high-performance computing. Deployed by major chipmakers and OEMs, JetCool’s state-of-the-art liquid cooling solutions ensure sustained advancements in device efficiency, performance, reliability, and sustainability. With investments from renowned entities in tech, semiconductor, and venture sectors such as Bosch and DuPont, JetCool continues to uphold its commitment to a forward-thinking mission. For additional information, please visit jetcool.com.

About Flex

Flex (Reg. No. 199002645H) is the manufacturing partner of choice that helps a diverse customer base design and build products that improve the world. Through the collective strength of a global workforce across 30 countries and responsible, sustainable operations, Flex delivers technology innovation, supply chain, and manufacturing solutions to diverse industries and end markets.

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