April 9-11 event in Nuremberg, Germany, to include 12 MIPI-related presentations

The MIPI Alliance, an international organization that develops interface specifications for mobile and mobile-influenced industries, today announced that the 22nd embedded world Exhibition & Conference, scheduled for April 9-11 in Nuremberg, Germany, will include a dozen presentations showcasing MIPI specifications, including three dedicated education tracks focused on MIPI camera and display specifications, MIPI in automotive, and the MIPI I3C utility and control bus.

The event covers all aspects of the development and application of embedded systems, from fundamental technologies to development processes and special fields of applications. MIPI Alliance is again serving as a Community Partner for the event, and members can register for the conference using the code “EWC24MIPI” to receive a 10% discount.

WHAT: Embedded World Exhibition & Conference



WHEN: April 9-11, 2024



WHERE: Nuremberg, Germany



WHO SHOULD ATTEND: Engineers and technical management working along the intersection of applied research and industrial applications of embedded systems.



MIPI CONFERENCE TRACKS:

The embedded world program includes nine MIPI-powered presentations within three Board Level Hardware Engineering tracks that will highlight MIPI I3C, MIPI Camera Serial Interface 2 (CSI-2), MIPI Display Serial Interface (DSI) and MIPI A-PHY. Three more MIPI member presentations will be featured within other sessions over the three-day event.

MIPI I3C Track - powered by MIPI

Session 5.4 Board Level Hardware Engineering

10 April | 11:00-12:45

• MIPI I3C, The Next-Generation Utility and Control Bus Supporting Time-Critical Applications
  
  Michele Scarlatella (MIPI Alliance)

• Demystifying I3C Protocol
  
  Martin Cavallo (Binho)

• Demonstrating the Benefits of I3C Through Real World Implementations
  
  Lars Häring (Microchip Technology)

MIPI Track - powered by MIPI

Session 5.5 Board Level Hardware Engineering

10 April | 13:45-15:30

• Challenges and Solution Supporting HiRes 13+ MP Camera Sensors within MIPI D-PHY Domain
  
  Mark Hoopes (Lattice Semiconductor)

• A MIPI DSI/CSI-2/D-PHY Deep Dive
  
  Ali Osman Ors (NXP Semiconductors)

• MIPI CSI-2 - Enabling Machine Vision in Industrial Applications
  
  Ariel Lasry (Qualcomm), Vice Chair of the A-PHY Working Group

Automotive Design Track

Session 5.10 Board Level Hardware Engineering

11 April | 09:30-11:15

• MIPI A-PHY Camera Ingestion for Automotive x86 Architectures
  
  Frederik John and Dr. Stephanie Friederich (Intel Deutschland)

• Connecting the Automotive Future: A Harsh Environment for Moving Bits
  
  Dr. Julien Henaut (BitifEye Test Solutions) and Eyran Lida (Valens Semiconductor)

• MIPI A-PHY v2.0 Automotive SerDes Interface - Supporting Software-Defined Vehicles and Next-Generation Centralized Automotive E/E Architectures
  
  Edo Cohen (Valens Semiconductor), Co-Chair of the MIPI A-PHY Working Group
  
  

MORE MIPI MEMBER PRESENTATIONS:

• How Can Connectivity Innovations Transform Machine Vision Applications in the Industrial Market?
  
  Yaki Sfadya (Valens Semiconductor)
  
  Session 7.3 Standards - Embedded Vision and Edge AI Standards
  
  9 April | 16:00 - 16:30

• Centralizing Radar Processing with High-Speed Connectivity
  
  Edo Cohen (Valens Semiconductor)
  
  Session 2.12 Wireless 2 - Connectivity Solutions
  
  11 April | 15:00 - 15:30

• Reducing the Microcontroller Pin Count by Utilizing its I3C Interface for Debugging
  
  Ingo Rohloff (Lauterbach)
  
  Session 6.12 Debugging - Systems & Software Engineering
  
  11 April | 15:30 - 16:00

Detailed descriptions of these sessions can be found at MIPI Events.

See the full agenda: embedded world Conference Program.

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About MIPI Alliance

MIPI Alliance (MIPI) develops interface specifications for mobile and mobile-influenced industries. There is at least one MIPI specification in every smartphone manufactured today. The organization has over 375 member companies worldwide and more than 15 active working groups delivering specifications within the extended mobile ecosystem. Members of the organization include handset manufacturers, device OEMs, software providers, semiconductor companies, application processor developers, IP tool providers, automotive OEMs and Tier 1 suppliers, and test and test equipment companies, as well as camera, tablet and laptop manufacturers. For more information, please visit www.mipi.org.

MIPI^®, A-PHY^®, CSI-2^®, DSI^® and I3C^® are registered trademarks owned by MIPI Alliance. D-PHY℠ is a service mark of MIPI Alliance.

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